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2000/02/17
Development of GaN Crystalline Thin Films with Low Dislocation Density by A New Crystal Growth Process

A joint research between Semiconductors Laboratory of RIKEN(the Institute of Physical and Chemical Research) and Research Institute for Electrical Science of Hokkaido University has succeeded in developing a simple in-situ production technology of gallium nitride(GaN) crystalline thin films with low dislocation density.The GaN films produced by this technology will be used as base substrates for the production of the high-quality III−nitride optoelectronic devices. This technology will lead to low-cost and high-performance violet laser diodes that will be used for reading and writing the next-generation digital versatile disks(DVDs).

The III−nitride semiconductors such as GaN, aluminium nitride(AlN) and indium nitoride(InN), emit light in green, blue and ultraviolet regions. Devices based on these semiconductors are expected to be used in various next-generation electronic machines and equipment. In general sapphire and silicon carbide have been used as base substrates for their grouth, since there are no other proper substrates. However, a great number of crystal defects (threading dislocations) are induced due to the large difference between the lattice constants of the III−nitride crystalline layers and the substrates.

The new technology has been developed to solve this serious problem. Only an in-situ process is rerquired and any complicated treatments outside of the crystal growth machine are unnecessary. The dislocation density is reduced to less than 1% from that of the convensional III−nitride films. It is promised that high-quality III−nitride layers would be grown on the GaN films with the reduced dislocation density.

Technique

(For further information, contact the Publicity Section, RIKEN: phone 048-467-9271)
(Source:STA TODAY April 2000)


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